Agenda

Welcome to Day 1

Presented By
()

Authored By
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Albert Oswald
Ian Symington
Tim Morris (NAFEMS)

Sponsor presentation Dassault Systemes: Tear Down These Walls! Making a Case for True Interdisciplinary Work on Electronics Parts and Components

Authored & Presented By
Frank Scharf (Dassault Systemes)

Electronics are everywhere and their presence continues to grow and expand into different industries and devices. As a result, environmental factors like structural loads, vibrations, humidity, or temperature become more and more relevant and should be considered during the design phase of electronics parts and components. While this is happening in some aspects already out of pure necessity, work is often done separately and sequentially by the various departments involved. This presentation aims at making the case for a truly integrated workflow that involves and connects all parties.

Hybrid Techniques for Power and Signal Integrity Co-Simulation in High-Frequency Electronic Systems

Authored & Presented By
Keerthivasan Radhakrishnan (SRM Institute of Science and Technology)

With modern high-frequency electronic systems, which are increasingly complex, the issues of power integrity and signal integrity have taken over as major design concerns. The demands for robust transmission place new requirements on simulation techniques that consider power delivery problems in concert. This paper presents a hybrid cosimulation approach for achieving an integrated methodology to ensure seamless interaction of power distribution networks with highspeed signal paths: power integrity and signal integrity analyses coupled together. This approach considers coupling of circuit-level simulations with 3D electromagnetic modeling for identification and mitigation of some of the major design issues, viz. signal degradation, crosstalk, and voltage drop, significantly accentuated in high-frequency environments. In this paper, we apply the discussed framework on a high-frequency SoC design. The main results are improved design robustness, reduced simulation time and higher power delivery and signal quality. The paper will discuss challenges in the setup of the models, as well as trade-offs between accuracy and computational cost. In this way, we will illustrate how integrating power and signal integrity simulations can provide to the designer the needed tool for ensuring the reliability and performance of next generation high-frequency electronic systems.

Direct Current Internal Resistance Analysis for Radio Frequency Over Fibre

Authored & Presented By
Shruthi G S (TE Connectivity India)

Power Integrity Analysis has become a crucial factor in determining the success or failure of modern electronic products. The increasing development of high-performance, energy-efficient, and miniaturized devices has made these systems more sensitive to power fluctuations, impedance, voltage levels, and current distribution. Direct Current Internal Resistance (DCIR) analysis plays a vital role in verifying the Power Delivery Network (PDN) on Printed Circuit Boards (PCBs), ensuring that each component receives adequate power to function as intended via the power nets. Excessive current flow through these compact devices can result in voltage drops and improper current distribution across resistive elements, which in turn converts electrical energy into heat. This increases power loss and causes PCB trace heating, potentially leading to circuit damage, structural integrity issues, and oxidation of PCB components. The objective of this simulation is to map the power distribution on the PCB and assess key metrics such as voltage drop, current density, and power loss. One of the major challenges is to mitigate voltage drop, high current density, via current, and power losses that arise due to increased resistance in intermediate components and copper traces. In the ongoing Marine Radio Frequency Over Fiber (RFOF) project, a simulation-driven design approach is employed to minimize the risk of product failure. This project utilizes a Multiphysics Methodology combining DCIR analysis with thermal simulations, offering insights into both electrical and thermal behavior. Simulating PCB trace heating is a complex task, but it can be simplified by coupling it with DCIR simulation. Power loss data from DCIR analysis, conducted in Ansys SIWave, is imported into Ansys ICEPAK for further evaluation. The power maps are integrated into the CAD and electrical models within ICEPAK, revealing a deviation of just 5-15% when compared to physical test results. This methodology is invaluable for identifying PCB hotspots and can be applied across various industries, including aerospace, defense, telecom, and marine electronics. The Multiphysics approach provides a reliable means of evaluating the thermal profile of PCBs due to the heating of current-carrying traces in these high-stakes applications.

Reliable Electronics through Simulation

Authored & Presented By
Frank Weiand (CADFEM Germany GmbH)

Increasing data rates, smaller devices and higher power densities lead to new challenges in electronics development. To transfer data accurately from one component to another (e.g. CPU to RAM), the characteristic impedances of the traces have to be as homogeneous as possible. Simulation helps to check the impedances, extract the S parameters and perform a time domain reflectrometry virtually. In addition, eye diagrams can be computed. To ensure proper voltage on all components, the IR drop can be computed. The losses then can be used as input for a thermal simulation to identify thermal hot spots on the PCB. In thermal management, critical junction temperatures on semiconductors must be avoided. Besides modifications on the PCB like thermal vias and thermal pads, simulation tools allow to add heat sinks and fans to optimize the thermal performance. Thermal cycles lead to mechanical stress and strain, notably on solder joints and vias. With a thermal-mechanical simulation, the cumulative thermal strain can be computed and the probability of failure estimated. Simulation is a proven tool for developing reliable electronics. It helps to reduce testing times and the number of prototypes. With simulation, the time to market of a new product can be reduced significantly.

Signal Integrity Analysis of High-Speed LPDDR4 Circuits in a PCB

Presented By
Ahmet Emin Gürevin (Numesys İleri Muhendislik Hizmetleri A.S.)

Authored By
Ahmet Emin Gürevin (Numesys İleri Muhendislik Hizmetleri A.S.)
Güven Eylen (Numesys Advanced Engineering A.Ş)

This study provides a comprehensive examination of DDR memory interface design, highlighting both the theoretical and practical aspects of signal integrity. With the growing complexity and speed demands of modern electronic systems, ensuring the reliable operation of DDR memory has become a critical design challenge. Utilizing SIwave, a powerful electromagnetic simulation tool, this research investigates key performance factors such as impedance matching, crosstalk effects, and DDR compliance, all of which are vital for maintaining signal integrity in high-speed PCB designs. The study delves deeply into how DDR structures can be effectively analyzed within SIwave, demonstrating the application of advanced numerical methods to perform impedance scans, identify potential crosstalk issues, and evaluate DDR eye diagram performance. By conducting both time and frequency-domain analyses, the research offers a detailed interpretation of the simulation results, explaining their significance in the context of maintaining signal integrity and meeting industry standards such as JEDEC for DDR systems. Beyond the practical analysis, the presentation also addresses the theoretical foundations that underpin DDR memory technologies. It explores the critical timing requirements, noise margins, and the impact of jitter on performance, providing attendees with a broader understanding of the challenges associated with DDR memory systems. By integrating both theoretical knowledge and practical insights, this study offers a holistic view of the signal integrity challenges faced in DDR memory design. The findings presented will not only guide engineers in optimizing their DDR-based systems but will also offer best practices for analyzing and improving high-speed memory interfaces using tools like SIwave. The research underscores the importance of simulation and analysis in ensuring that DDR memory operates reliably in increasingly complex electronic environments.

Signal Integrity Simulations on Conversion of Ethernet to Optical Fiber Communication Technology

Authored & Presented By
Shruthi G S (TE Connectivity India)

The demand for Optical Signal communication is increasing in various fields, including the Aerospace and Defense sectors. This is due to the growing trend of advanced-level communication involving Ethernet signal communications and the conversion of the same into Optical Signals. The benefits of this technology are far-reaching, including the bi-directional use of Tx and Rx signals for Ground applications of Defense. Optical fibers can be designed to be long, making them a highly viable choice for long-distance communication than power cables. They are also more cost-effective and power-efficient than electrical wiring and can carry signals to longer distances without requiring additional devices. This is because they are thinner and don't cause electromagnetic interference for the cables around them. Here, the product model is designed in three stages based on the application and technology requirements, when Ethernet signals are the inputs, Optical signals are the output through a board-to-board Connector. The objective of the Signal Integrity Simulation is to analyze the signal quality through Step response, Insertion, and Return losses in the transmission and reception path of the signals and Eye diagrams which recognize noise, jitter, and signal effects of the Optical signals. The Signal Integrity Simulation was performed using ANSYS-HFSS and ANSYS-SIWave tools to understand the real-time performances through Frequency Domain analysis of Insertion loss and return loss and time domain analysis through Eye Diagrams. SI Simulations play a significant role in ensuring that hardware functions optimally, performs well, and is reliable. By using optimization techniques during the design stage, the losses can be minimized, leading to reduced physical test costs, shorter testing times, decreased re-designing efforts, and lower failure rates of the products. It's always better to identify and mitigate potential issues during the design phase through simulations rather than to discover them later during physical testing.

Discussion

Welcome to Day 2

Presented By
()

Authored By
()
Albert Oswald
Ian Symington
Tim Morris (NAFEMS)

Automating Compact Model Parameter Extraction: Industry-Grade Implementation and Benchmarking of Machine Learning-Driven Derivative-Free Algorithms

Presented By
Zijian Song (Keysight Technologies)

Authored By
Zijian Song (Keysight Technologies)
Mohit Khanna
Yiao Li
Long Ma
Rafael Perez Martinez
Alexander Petr
Jose-Luis Pino
Roberto Tinti (Keysight Technologies)

Compact model parameter extraction is a crucial step in SPICE model development. Modern compact models often require hundreds of parameters to accurately represent emerging semiconductor devices due to the complexity of the underlying physics. Traditionally, parameter extraction has been performed manually, combined with gradient-based optimization approaches such as the Levenberg-Marquardt algorithm. However, these methods tend to be inefficient and prone to failure when dealing with high-dimensional, non-convex optimization landscapes involving tens of model parameters. In response to these challenges, machine learning-driven derivative-free optimization methods, such as the Tree-Structured Parzen Estimator (TPE), have been proposed to address parameter extraction. This approach eliminates the need for manual extraction, streamlining the overall parameter extraction process. In this work, we advance our research on derivative-free algorithms and present the first industry-level, productized solution based on TPE for automated compact model parameter extraction. We utilize our derivative-free extraction approach to tackle four distinct device modeling problems: a Diamond Schottky diode (3 parameters in the SPICE diode model), a Si CMOS FET (10 parameters in the BSIM4 model), a SiGe HBT (20-30 parameters in the MEXTRAM model), and a GaN HEMT (20-30 parameters in the ASM-HEMT model). Additionally, we benchmark the performance of various optimization algorithms including Levenberg-Marquardt, Quasi-Newton, Gradient Descent, demonstrating that our proposed TPE derivative-free algorithm consistently outperforms traditional gradient-based methods across a range of complexities. We also benchmark other derivative-free estimators, including random search and particle swarm optimization, to provide further insights into their comparative performance. The results highlight the benefits and limitations of our proposed TPE derivative-free optimization algorithm in parameter extraction for modern semiconductor device models.

Keep it cool: Multiphysics Simulations for Long Term Thermal Reliability

Authored & Presented By
Harry Kennedy (Altair Engineering)

Engineers continue to develop more and more microelectronic components/solutions in attempts to reduce size, weight, and power (SWaP). Engineers are forced to design smaller products with increased capability which often increase heat effects to components and PCBs. Understanding and planning for field use is a necessary step in the design process. Designing for field use of electronic systems means that components, equipment, and systems could be in use for decades with confidence. Thermal and mechanical stress must be considered not only for the immediate event, but also for effect over years of repeated usage. The repeated thermal stress causes solder fatigue on the solder joint holding the components to the PCB. Thankfully, simulation can help design engineers understand the effects of thermal stress to mitigate risks before production. This allows better design decisions and saving countless dollars on underperforming products. This webinar will focus on understanding how extreme environments introduce mechanical (physical) stress on the PCB. Solder fatigue due to repeated thermal stress will break down components and affect the product system lifecycle. Using simulation, engineers can determine which components to use in a system and calculate the expected lifecycle of the PCB before damage and procedures for development of preventative maintenance practices. More specifically, we will cover: • Overview of mechanical and thermal stress within PCB field usage • Equations to model thermal expansion and solder fatigue in PCBs • Modeling mechanical stress using simulation software • Understanding how thermal stress affects PCBs • Using simulation to predict product lifecycle due to solder fatigue Following the presentation, engineers that utilize modeling and simulation software will be able to make better design decisions based on the full product lifecycle. Engineers will also have a better understanding of how thermal stress introduces the need for continued preventative maintenance on/to electronic components and PCBs.

Finite Element Simulation of 3D Grounded Coplanar Waveguides with Lumped Ports and RLC Components

Presented By
Abhishek Deshmukh (Quanscient Oy)

Authored By
Abhishek Deshmukh (Quanscient Oy)
Alexandre Halbach (Quanscient Oy)
Bassou Khouya (Quanscient Oy)
Alex Stockrahm (Quanscient Oy)
Andrew Tweedie (Quanscient Oy)

Grounded coplanar waveguides (GCPWs) are critical in a wide range of high-frequency applications, such as automotive sensors, 5G networks, and satellite communication, due to their ability to efficiently transmit signals with minimal loss and controlled impedance. GCPWs feature a central signal conductor flanked by ground planes on the same dielectric layer, with grounding beneath the substrate, forming an efficient transmission line. They are valued for their excellent signal integrity, high-frequency performance, compactness, and ease of integration with active and passive components. However, designing of GCPWs comes with several challenges including impedance matching, parasitic effects due to lumped components, radiation and dielectric losses affecting signal integrity to name a few. Thus, accurate and fast numerical simulations can be very helpful in several design iterations to obtain an optimal design configuration. In this work, we present the simulation of 3D GCPWs incorporating lumped ports and passive RLC components using the Finite Element Method (FEM) in Quanscient Allsolve. Key factors such as substrate properties and waveguide geometry are analyzed for their impact on circuit performance, including S-parameters and impedance matching. The inclusion of RLC components enhances the design flexibility, allowing for tuning and filtering within the waveguide structure. The cloud-based nature of the simulation tool enables running large-scale simulations faster, as well as running multiple such simulations simultaneously; thereby significantly accelerating the parametric and design optimization studies.

Accelerating Innovation of High Tech Devices with unified modeling and multiphysics simulation approach on 3DEXPERIENCE Platform

Presented By
Sagar Mandave (Dassault Systèmes)

Authored By
Sagar Mandave (Dassault Systè
mes)
Ritupriya Bobhate (Dassault Systems)
Srikrishna Chittur (Dassault Systems)
Abhishek Kadri (Dassault Systems)
Madhura Karve (Dassault Systems)
Nayomi Maddala (Dassault Systems)
Sreeharsh Nair (Dassault Systems)
Mark Pickering (Dassault Systems)
Zen Sugiyama (Dassault Systems)

This multi-physics case study of a smart projector and speaker system demonstrates the unified modeling and simulation (MODSIM) approach offered by the 3DEXPERIENCE Works portfolio for electronic device manufacturers to accelerate innovation, reduce development costs, and enhance product quality. This case study highlights how the unification of requirements, collaboration, modeling, and simulation can empower high-tech device designers to address typical challenges and keep up with industry trends. Informed design improvements for the smart projector and speaker system, driven by multi-physics simulation workflows—including 3-point bending, drop testing, antenna placement, signal integrity analysis, EMI-EMC compliance checks, electronic thermal management, and injection molded plastic casing manufacturability—will be showcased to articulate the process and benefits of the MODSIM approach.

Optimized MOSFET Module Design through Multi-Domain Simulation Integration: A Case Study using Optimus by Noesis Solutions and Cadence Design Systems‘ toolchain

Presented By
Thibault Jacobs (Noesis Solutions NV)

Authored By
Thibault Jacobs (Noesis Solutions NV)
Srdjan Djordjevic (Cadence Design Systems)

This study outlines an optimized design process for MOSFET power modules, essential for high-power electronic systems requiring efficient, reliable, and thermally stable operation. A comprehensive methodology is developed integrating multiple simulation domains using Optimus by Noesis Solutions alongside a suite of Cadence tools – including Cadence Allegro, Clarity 3D quasi-static solver (Clarity 3DQS), Cadence PSpice, and Cadence Celsius. Optimus functions as the central hub, coordinating a simulation-driven design optimization process across the Cadence environments. This integration facilitates an intelligent, iterative approach to optimize various design features, including but not limited to the positioning of the MOSFET, the number of wire bonds, and their diameters, with the aim to minimize electrical and thermal losses. Such design choices are crucial as they significantly impact the module's performance. In the design workflow, Cadence Allegro is used for PCB layout and component positioning, setting the foundation for further simulations. The Clarity 3DQS solver then extracts parasitic inductance, particularly from the wire bonds and traces within the MOSFET module. This data feeds into Cadence PSpice which simulates the circuit to assess the effects of parasitic inductance on switching performance, power losses, and signal integrity. Concurrently, Cadence Celsius conducts 3D thermal analysis to evaluate heat dissipation within the module, ensuring the design remains within safe operational temperatures under various conditions. This simulation checks for potential thermal hotspots, crucial for maintaining the reliability and efficiency of the module. Through Optimus, the process not only aims at reducing parasitic inductance and thermal resistance but also enhances power handling capabilities by intelligently balancing electrical and thermal performances. The results demonstrate noticeable improvements in module efficiency and reliability by optimizing critical factors such as wire bond placement, count, and diameter. This paper highlights the advantages of an automated, multi-domain optimization strategy using Optimus and the Cadence‘s toolchain, proving effective across various industries like automotive, telecommunications, and industrial electronics. The approach underscores the significant benefits of leveraging integrated simulation tools to streamline the design process and achieve superior module performance.

Industrial applications of electromagnetic simulations to accelerate time-to-market

Presented By
Ritupriya Bobhate (SIMULIA India)

Authored By
Ritupriya Bobhate (SIMULIA India)
Srikrishna Chittur (Dassault Systemes)
Abhishek Kadri (Dassault Systemes)
Nayomi Maddala (Dassault Systemes)
Sagar Mandave (Dassault Systemes)

In the competitive industrial landscape, the demand for efficient, smart, and compact instruments presents challenges including device operability, precise location tracking, electromagnetic interference, and susceptibility to high electric discharge currents etc. Electromagnetic simulations help address these challenges to ensure and accelerate successful product introduction to market. This presentation provides a comprehensive study of electromagnetic analysis to address key challenges such as EMI/EMC compliance testing, PCB performance and antenna positioning in complex environments. We will demonstrate how strategic antenna positioning enhances coverage efficiency in antennas, how different topologies can reduce interference, and improves compliance readiness, leveraging electromagnetic simulations performed with industry-leading CST solver from Dassault Systemes. These simulation findings are instrumental in ensuring compliance readiness, reducing prototypes and physical tests, as well as enabling design exploration, thereby saving cost and time, while accelerating innovation. This presentation is focused on EMI/EMC compliance demands to testify radiated emission, conducted emission, signal integrity , power integrity, and shielding effectiveness analysis. Most importantly, no electromagnetic compliance means no go-to-market for manufacturers. We will demonstrate how electromagnetic simulations can help address these demands with a digital twin approach. Various numerical techniques such as Finite element model method using Time domain/ TLM solver, full wave electromagnetic solutions will be discussed during this session. Additionally, benefits of an integrated multiphysics simulation approach to provide Electromagnetic as well as Thermal behavior due to unwanted electromagnetic fields generated in the operating conditions, will be highlighted. Another critical aspect of device development is designing or choosing the right antenna with electro-mechanical and packaging constraints. To ensure seamless communication, Antenna performance needs to be checked for possible multiple locations for making sure that electromagnetic radiations emerging out of antenna are not hindering the performance of peripheral electronics & other devices inside the equipment or device. In this presentation, we will discuss some of the industry practices to explore and identity optimal antenna designs and locations leveraging electromagnetic simulation workflows.

Streamlining Phased Array Antenna Design with PYAEDT: A Path Towards AI-Driven Optimization

Authored & Presented By
Fatemeh Hoveizavi (EDRMedeso)

This paper explores the application of PYAEDT, a Python-based interface for automating ANSYS Electronics Desktop (AEDT), to the design and optimization of phased array antennas within the HFSS (High-Frequency Structure Simulator) platform. Phased array antennas are critical in modern communication systems, offering dynamic beam steering capabilities for applications in radar, wireless communications, and satellite systems. However, their design often involves complex electromagnetic simulations and iterative tuning processes, which can be time-consuming. Using PYAEDT, we demonstrate how automation can simplify key aspects of the design workflow, from the initial configuration of array elements to full system optimization. This approach enables parametric studies, adaptive beamforming, and performance evaluations such as gain, directivity, and S-parameters, all while minimizing human error and computational overhead. Additionally, the paper presents a detailed case study where PYAEDT is used to optimize a phased array antenna for beam steering and radiation performance, highlighting significant improvements in design efficiency and accuracy. The results underscore the potential of PYAEDT to transform phased array antenna design, making it more accessible and streamlined for engineers and researchers. By automating complex tasks within HFSS, the integration of PYAEDT allows for faster iterations and deeper insights into the electromagnetic behavior of advanced antenna systems. The next step involves leveraging these results to train AI tools capable of automating and further optimizing phased array antenna design, paving the way for even more efficient and intelligent design processes.